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Wafer Thinning
 
 
 
 

 
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Wafering Service

The wafering service provides wafer reclaim process services and new test wafer products. Wafer reclaim integrates with self-developed professional stripping, polishing and cleaning technology, as well as advanced measurement tools to provide customers with high level processing services. New test wafer products applied with high quality semiconductor-grade crystal ingots, which are processed by Psi independent production line.

 

Application:

  • For semiconductor IC manufacturing process monitoring.
  • Wafer used for process monitoring and can be reused and prolongs its service life to achieve the purpose of reducing costs and complying with ESG.

Product & Service:

  • 6inch, 8inch and 12inch reclaim wafer.
  • 8inch and 12inch test wafer, P or N type.

Contact:

 
 
 
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