Wafer Thinning Service
The Wafer Thinning Division provides ultra-thinning grinding, surface treatment, metal film deposition, process technology, and combined wafer testing to offer customers a comprehensive processing service. Wafer thinning technology fully meets the market's high demand for semiconductor components that are thin, light, small, and high-performance, as well as energy-saving. By using wafer thinning technology, high-density interconnects for integrated circuits can be achieved, reducing power loss and performing component packaging for thinning and miniaturization. This results in an overall improvement in semiconductor component performance.
Application：
- Reduction of conduction resistance
- Ultra-thin packaging or sealing
- Flip Chip thick metal packaging
Product & Service：
- 6-inch, 8-inch, and 12-inch P-type or N-type silicon wafer thinning (standard and Taiko)
- 6-inch and 8-inch SiC, GaN wafer thinning
- Metal film deposition and etching process for front/back sides of wafers
- Wafer testing (Chip Probing Test)
Contact：
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