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Incoming Wafer Information
Wafer type
4 inch
5 inch
6 inch
8 inch
12 inch
Wafer Material
Si- P type
Si- N type
Other
Original thickness
Wafer thickness：
±
um
mil
Pad Material
Al Alloy
Cu
Other
Passivation Material
Nitride
Oxide
Other
With Polyimide On Wafer
No
Yes , type
Exclusion zone width
mm
Foundry Name
(Option)
Grinding process requirement
Grinding
No
Yes, after grinding thickness
um
mil
BSM process requirement
BSM material
Ti / Au
Ti / Ni / Ag
Ti / Al
Ti / Ni / Au
Ti / Ni / AuSn
Ti / NiV / Ag
Other
BSM thickness
Å
Dicing process requirement
Chip Size
Chip
X axis(um)
Y axis(um)
Scribe line width(um)
Other suggestion or comment
Contact
Name of Company
Address
Country
Tel
Fax
E-mail
Contact
Position
驗證碼
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