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客製電池需求表
200mm RECLAIM 客戶規格詢問表
300mm RECLAIM 客戶規格詢問表
 
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Incoming Wafer Information
 
Wafer type 4 inch  5 inch  6 inch  8 inch  12 inch
Wafer Material Si- P type  Si- N type  Other  
Original thickness Wafer thickness: ± um mil
Pad Material Al Alloy  Cu  Other
Passivation Material Nitride  Oxide  Other
With Polyimide On Wafer No
Yes , type
Exclusion zone width mm
Foundry Name (Option)
 
Grinding process requirement
 
Grinding No
Yes, after grinding thickness
um mil
 
BSM process requirement
 
BSM material Ti / Au  Ti / Ni / Ag  Ti / Al  Ti / Ni / Au
Ti / Ni / AuSn  Ti / NiV / Ag  Other
BSM thickness Å
 
Dicing process requirement
 
Chip Size Chip  X axis(um)  
Y axis(um)  Scribe line width(um)
Other suggestion or comment
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